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(Transportation-News.com, February 15, 2016 ) The high-performance thermal interface materials in the form of nano diamonds and increasing use of carbon nanotubes as heat sinks are some of the factors, providing ample growth opportunities for the thermal interface materials market. One of the major factors restraining the growth of the market is its physical properties that limit thermal interface material’s performance.
Explore more about Global Thermal Interface Materials Market at: https://www.psmarketresearch.com/market-analysis/thermal-interface-materials-market
Asia-Pacific leads the global thermal interface materials market. The Asia-Pacific market is also expected to grow with the highest rate in coming years, where India, Japan, and China are offering considerable growth opportunities. This is due to the growth in end-use industries of the countries such as telecom, electrical and electronics, medical, and automotive.
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To minimize the interface thermal resistance between heat sources and heat sinks, the small imperfections and voids are filled with the thermal interface materials. The thermal interface materials are used to connect two components and remove air gaps from the interface, by producing a thermally conductive bond for transferring heat from crucial operating components of the device. In electric vehicles which have large energy storage systems, heat management is necessary. As vehicles are incorporated with more electronics and electrical components, thermal management is becoming progressively important.
Due to the micro-scale surface unevenness, the contact area among heat sinks and high power heat generating components is less than 4%. To enhance heat conduction through the interface and reduction in thermal interfacial resistance, the thermal interface materials are used. Also, for enhancing the device efficacy, proper selection of thermal interface materials is an essential step. Investing in the interface material is more effective than applying various cooling techniques, so as to create a suitable thermal contact.
Browse Related Market Research at: https://www.psmarketresearch.com/industry-report/semiconductor-and-electronics
Some of the competitors in the thermal interface materials market are Parker Hannifin Corporation, Laird Technologies Inc., Wakefield-Vette Inc., Dow Corning Corporation, Honeywell International Inc., Momentive Performance Materials Inc., Zalman Tech Co. Ltd., Henkel AG & Co. KGAA, Indium Corporation, and 3M Company.
Global Thermal Interface Materials Market Segmentation
By Type
Metal-Based
Tapes and Films
Phase Change Materials
Greases and Adhesives
Gap Fillers
Thermal Compounds
Compressible Interface Materials
Elastomeric Pads
By Application
Medical Devices
Automotive Electronics
Computers
Industrial Machinery
Telecom
Consumer Durables
By Geography
North America
Europe
Asia -Pacific
ROW
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