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(Transportation-News.com, April 21, 2017 ) A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler. Publisher's analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020. For more information about this report: http://www.reportsweb.com/global-system-in-package-market-2016-2020 Covered in this report The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.
The market is divided into the following segments based on geography: - Americas - APAC - EMEA
Publisher's report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors - Amkor Technology - ASE - JCET - SPIL - UTAC
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Other prominent vendors - ChipMOS Technology - ChipSiP Technology - NANIUM - Octavo Systems - Samsung Electro-Mechanics
Market driver - Need to control rising costs - For a full, detailed list, view our report
Market challenge - High inventory levels in supply chain - For a full, detailed list, view our report
Market trend - Growth of OSAT vendors - For a full, detailed list, view our report
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Table of Contents: PART 01: Executive summary PART 02: Scope of the report PART 03: Market research methodology PART 04: Introduction PART 05: Technology overview PART 06: Market landscape PART 07: Market segmentation by application PART 08: Market segmentation by interconnect technology PART 09: Market segmentation by end-user PART 10: Geographical segmentation PART 11: Market drivers PART 12: Impact of drivers PART 13: Market challenges PART 14: Impact of drivers and challenges PART 15: Market trends PART 16: Vendor landscape PART 17: Appendix
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