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(Transportation-News.com, September 07, 2016 ) Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the new addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.
Publisher's analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.
For more information about this report: http://www.reportsweb.com/global-bonding-wire-packaging-material-market-2016-2020
Covered in this report
The report covers the present scenario and the growth prospects of the global bonding wire packaging material market for 2016-2020. To calculate the market size, the report considers revenue generated from the consumption of bonding wires for packaging materials.
The market is divided into the following segments based on geography:
- APAC
- Europe
- North America
- ROW
Publisher's report, Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
- TANAKA Precious Metals
- Heraeus Deutschland
- California Fine Wire
- MK Electron
Inquire for Report at http://www.reportsweb.com/inquiry&RW0001291920/buying
Other prominent vendors
- AMETEK
- EMMTECH
- Inseto
- Palomar Technologies
- RED Micro Wire
- SHINKAWA
- Sumitomo Metal Mining
- Tatsuta Electric Wire & Cable
Market driver
- Rising need for miniaturization
- For a full, detailed list, view our report
Market challenge
- Migration to flip chip packaging technology
- For a full, detailed list, view our report
Market trend
- Migration to smaller diameter wires
- For a full, detailed list, view our report
ReportsWeb.com
Priya Sisodia
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Source: EmailWire.Com 
Source: EmailWire.com
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